IPC 9703 PDF

Buy IPC 0 IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINES FOR SOLDER JOINT RELIABILITY from SAI Global. IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITY. JS Published: Mar Status: Reaffirmed> May The client creates file into datadir with the permission Without write Enhancement: IPC file permission # Closed.

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The diversity of applications for electronic devices has led to increased severity of shock loading, as well as a larger range of shock impulses that are applied based on the usage environment.

Ilc gage testing SGT allows objective analyses of strain conditions that SMT components are subjected to during assembly and test. However, it is important to note that pro-active SGT can result ultimately in significant cost savings.

As the electronics industry shifts toward finer-pitch BGA components, thinner PCBs and lead-free interconnects, the robustness of second-level interconnects SLIs may be affected adversely.

This is why many manufacturers are required to operate under strain levels specified by their customers or component suppliers. Be the first to review this item Would you like to tell us ipx a lower price? Amazon Renewed Refurbished products with a warranty. This standard addresses the development and application for shock testing to surface mount components on PCBs.

In addition to BGA components, SGT also is an invaluable tool for analyzing failures on other discrete surface mount devices, such as capacitors and resistors. If you are a seller for this product, would you like to suggest updates through seller support?

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Mudasir Ahmad, manufacturing engineer, Cisco Systems, may be contacted at ; mudasir. For EMS providers, SGT serves as a process-characterization tool and allows the pro-active identification of high-strain sequences during assembly and test. As SGT continues to gain momentum in the electronics industry, it is clear that it has evolved from a simple failure-analysis method to a standardized process-characterization tool.

This also reduces downtime due to electrical and functional test failures. Smaller gage sizes can be more susceptible to variations in the board structure and localized strain concentration. Amazon Rapids Fun stories for kids on the go. Another benefit of SGT standardization is that it helps baseline typical strain readings observed during each assembly step.

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Strain Gage Testing: Standardization

Establishes mechanical drop jpc shock and test guidelines for assessing solder joint reliability ilc printed board assemblies from system to component level. The process involves attaching strain gages on circuit board assemblies at specified locations Figure 2.

Most rely on customers to conduct these tests Figure 3. Aside from manufacturing characterization, SGT also can be used as a mechanical design-validation tool. Such baseline data can give component suppliers better estimates of end-use strain levels applied to devices. Data are being accumulated by the industry on the reliability of components that are subjected to the higher soldering temperatures for SAC.

IPC Mechanical Shock Test Guidelines for Solder Joint Reliability: IPC: : Books

This document addresses methods to define mechanical shock use-conditions, methods to define system level, system printed board level and component test board level testing that correlate to such use conditions and guidance on the use of experimental metrologies for mechanical shock tests. The document also provides reference strain limits. This information is critical for EMS providers and their customers as it provides assurance of a safe assembly process.

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Discover Prime Book Box for Kids. As awareness increases, it becomes obvious that SGT is a necessary tool for test-fixture vendors.

Few leading fixture suppliers ic embraced SGT as part of their product-validation process. Perhaps the most pressing area of development is that of real estate, particularly in mobile computing platforms and small consumer devices.

IPC/JEDEC MECHANICAL SHOCK TEST GUIDELINE FOR SOLDER JOINT RELIABILITY | JEDEC

In more spacious designs, tooling holes and other obstructions may be present where a gage should be placed. Board-flexure control using strain gage measurement has proven effective in preventing these occurrences, and continues to gain acceptance as a method to identify stressful processes during manufacturing, handling, testing and assembly.

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When paired with computational analysis techniques, SGT provides insights on the stresses that critical packages are subjected to during such conditions.

There is a critical need for this test method, as designing test conditions that can replicate these varied environments is becoming increasingly difficult. For many vendors, cost is an important factor when implementing routine SGT on their fixtures.